CURRENT CUT-OFF DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

A current cut-off device 10 is housed within a case 1 and is provided with a conducting plate 20 and a first deformation plate 30. The conducting plate 20 is electrically connected to an electrode assembly 3. The first deformation plate 30 is electrically connected to a terminal 7 and is disposed on one side of the conducting plate 20. The conducting plate 20 includes a contact part 22 which contacts the first deformation plate 30 when the electrode assembly 3 and the terminal 7 are in an electrical conducting state. The first deformation plate 30 is electrically connected when the electrode assembly 3 and the terminal 7 are in an electrical conducting state, but is not electrically connected to the conducting plate 20 when the electrode assembly 3 and the terminal 7 are in a non-conducting state. A weld part 40 is provided to the contact part 22 at the other side of the conducting plate 20. At the position at which the weld part 40 is disposed, the conducting plate 20 and the first deformation plate 30 are connected, and the thickness of the conducting plate 20 is no greater than the thickness of the first deformation plate 30.