发明名称 |
INTEGRATED CIRCUIT (IC) MODULE COMPRISING AN INTEGRATED CIRCUIT (IC) PACKAGE AND AN INTERPOSER WITH EMBEDDED PASSIVE COMPONENTS |
摘要 |
An integrated circuit (IC) module that includes an integrated circuit (IC) package, a plurality of first solder interconnects coupled to the IC package, an interposer coupled to the IC package through the plurality of first solder interconnects a plurality of second solder interconnects coupled to the interposer; and a printed circuit board (PCB) coupled to the interposer through the plurality of second solder interconnects. The interposer includes an encapsulation layer, a first passive component at least partially embedded in the encapsulation layer, and a plurality of interconnects coupled to the first passive component. The encapsulation layer includes a mold and/or an epoxy fill. The first passive component is configured to operate as an electronic voltage regulator (EVR) for the IC module. In some implementations, the interposer is a fan out interposer. |
申请公布号 |
US2017064837(A1) |
申请公布日期 |
2017.03.02 |
申请号 |
US201514842403 |
申请日期 |
2015.09.01 |
申请人 |
QUALCOMM Incorporated |
发明人 |
Li Yue;Paynter Charles David;Lane Ryan David;Zang Ruey Kae |
分类号 |
H05K1/18;H01L21/56;H01L23/498;H05K1/03;H05K1/11 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
|
主权项 |
1. An interposer comprising:
an encapsulation layer; a passive component at least partially embedded in the encapsulation layer; and a plurality of interconnects coupled to the passive component. |
地址 |
San Diego CA US |