发明名称 |
AN AQUEOUS POLISHING AGENT COMPRISING SOLID POLYMER PARTICLES AND TWO COMPLEXING AGENTS AND ITS USE IN A PROCESS FOR POLISHING PATTERNED AND UNSTRUCTURED METAL SURFACES |
摘要 |
An aqueous CMP agent, comprising (A) solid polymer particles interacting and forming strong complexes with the metal of the surfaces to be polished; (B) a dissolved organic non-polymeric compound interacting and forming strong, water-soluble complexes with the metal and causing an increase of the material removal rate MRR and the static etch rate SER with increasing concentration of the compound (B); and (C) a dissolved organic non-polymeric compound interacting and forming slightly soluble or insoluble complexes with the metal, which complexes are capable of being adsorbed by the metal surfaces, and causing a lower increase of the MRR than the compound (B) and a lower increase of the SER than the compound (B) or no increase of the SER with increasing concentration of the compound (C); a CMP process comprising selecting the components (A) to (C) and the use of the CMP agent and process for polishing wafers with ICs. |
申请公布号 |
EP2427522(B1) |
申请公布日期 |
2017.03.01 |
申请号 |
EP20100713989 |
申请日期 |
2010.04.19 |
申请人 |
BASF SE |
发明人 |
RAMAN, Vijay Immanuel;GUBAYDULLIN, Ilshat;LI, Yuzhuo;BRANDS, Mario;LAN, Yongqing |
分类号 |
C09G1/02;C09K3/14;H01L21/321 |
主分类号 |
C09G1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|