| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of a control device, which can achieve increase in mounting area of an electronic component and downsizing of a printed circuit board while ensuring a radiation performance of the electronic component.SOLUTION: A heat dissipation structure of a control device comprises: a printed circuit board 2 having a peripheral part 2E sandwiched by a base 31 and a cover 32 to be included in a casing 3; a heat dissipation pattern 6 which extends from a mounting region 4P of an electronic component 4 of the printed circuit board 2 to the peripheral part 2E which becomes a mounting forbidden zone; and a heat transfer part 7 provided on the peripheral part 2E, for transferring heat from the heat dissipation pattern 6 to the base 31. The printed circuit board 2 includes a first conductor layer 23 formed in an inside layer of the printed circuit board 2 and a second conductor layer 25 which becomes a mounting surface, in which the heat dissipation pattern 6 is formed in the same layer with the first conductor layer 23. |
