| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a circular wafer capable of discriminating a crystal orientation of the wafer even after rear face grinding in the wafer with which a mark indicating the crystal orientation is formed on a rear face.SOLUTION: A processing method of a circular wafer with which a mark indicating a crystal orientation is formed on a rear face includes: a protective tape mounting step of mounting a front face protective tape formed from a base material and a sticker layer disposed on the base material on a front face of the circular wafer; a mark forming step of forming the mark indicating the crystal orientation of the circular wafer on the front face protective tape by discoloring the front face protective tape by irradiating the front face protective tape at a position corresponding to the mark of the circular wafer with a laser beam after implementing the protective tape mounting step; and a grinding step of grinding the rear face of the circular wafer with grinding means while holding the circular wafer by holding means via the front face protective tape after implementing the mark forming step. Even after the mark is removed in the grinding step, the crystal orientation of the circular wafer can be discriminated from the mark formed on the front face protective tape. |
