| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting structure of a heat sink in which a heat sink, to be mounted on a position matching a new CPU, can be moved even if the size of a CPU is changed.SOLUTION: The mounting structure of a heat sink includes a substrate 1 on which a circuit pattern is formed, an electronic component to be mounted on the substrate 1, and a heat sink 3 fixed to the substrate 1 by means of a screw 6, and cooling the electronic component. The substrate 1 is provided with a screw hole area 5 where the circuit pattern is not formed, around the electronic component mounting position, and a screw hole 9 of the screw 6 for fixing the heat sink 3 is provided in the screw hole area 5. The screw hole area 5 has an area larger than the area required for providing one screw hole 9. |
