发明名称 研摩材スラリー及びそれを用いた基板の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a polishing material slurry used in a method for manufacturing a substrate that can form a favorable epitaxial growth film thereon.SOLUTION: A polishing material slurry of the present invention contains polishing abrasive grains having a crystalline diameter of 10 nm or more and 150 nm or less and an average grain size of 0.05 μm or more and 3.0 μm or less and comprising a cerium oxide, and is used for polishing a substrate comprising a single crystal of a nitride of a group 13 element. By polishing a surface of a single crystal of a nitride of a group 13 element using the polishing material slurry, a substrate having multi-thread atomic steps extending one direction on a surface thereof is manufactured.
申请公布号 JP6088953(B2) 申请公布日期 2017.03.01
申请号 JP20130197232 申请日期 2013.09.24
申请人 三井金属鉱業株式会社 发明人 徳地 成紀;丸山 陽兵;大鹿 元己
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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