发明名称 半導体レーザ装置及びその製造方法
摘要 In a semiconductor laser device including a semiconductor laser element that emits laser light from an emission region thereof, a cap having a peripheral wall and a ceiling wall that cover the semiconductor laser element and having a window portion formed in the ceiling wall to face the emission region, and a transparent optical member that fills the window portion, the optical member is formed by curing a liquid resin and holds the ceiling wall, and a light incidence surface of the optical member faces the emission region and is formed by natural flow of the liquid resin.
申请公布号 JP6088061(B2) 申请公布日期 2017.03.01
申请号 JP20150541469 申请日期 2014.08.21
申请人 シャープ株式会社 发明人 土田 和弘
分类号 H01S5/022 主分类号 H01S5/022
代理机构 代理人
主权项
地址