发明名称 |
POWER MODULE SUBSTRATE UNIT AND POWER MODULE |
摘要 |
A power-module substrate unit having at least one power-module substrate including one ceramic substrate, a circuit layer formed on one surface of the ceramic substrate, and a metal layer formed on another surface of the ceramic substrate, and a heat sink on which the metal layer of the power-module substrate is bonded, in which the metal layer is made of an aluminum plate having purity of 99.99 mass% or higher; the heat sink is made of an aluminum plate having purity of 99.90 mass% or lower; and the circuit layer has a stacking structure of a first layer made of an aluminum plate having the purity of 99.99 mass% or higher and being bonded to the ceramic substrate and a second layer made of the aluminum plate having the purity lower than 99.90 mass% and being bonded on a surface of the first layer. |
申请公布号 |
EP3136433(A1) |
申请公布日期 |
2017.03.01 |
申请号 |
EP20150782958 |
申请日期 |
2015.04.24 |
申请人 |
Mitsubishi Materials Corporation |
发明人 |
OI, Sotaro;OOHIRAKI, Tomoya |
分类号 |
H01L23/36;H01L23/12;H01L23/13;H05K1/02 |
主分类号 |
H01L23/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|