| 摘要 |
The invention relates to a device for feeding a stream of hot gas to a printed circuit board during convection soldering in a soldering installation. The feed device comprises a nozzle plate (1) having at least one drilled hole (3), which opens into a hot gas nozzle (2) arranged on the nozzle plate (1) and having a nozzle opening (4). The invention is defined in that the hot gas nozzle is formed by a flexible helical spring (2). The invention permits the nozzle plate with the hot gas nozzles to be advanced right up to the printed circuit board under all peripheral conditions which occur. In particular, the printed circuit board can, for instance, be advanced right up to the nozzle plate even when a central support for the printed circuit boards or some other disruptive contour is present. It is also possible to move the central support transversely with respect to the direction of transport of the circuit boards in the soldering installation without the printed circuit board having to be positioned at an increased distance from the nozzle plate, since, thanks to the invention, collisions between the nozzles and the central support or some other disruptive contour do not cause damage. |
