| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device capable of accurately and easily positioning a semiconductor lamination unit in a case and being downsized.SOLUTION: A power conversion device comprises: a semiconductor module 3; a cooling tube 41; a cooler 4 including a refrigerant introducing unit 42 and a refrigerant discharging unit 43; and a case 7 which houses a semiconductor lamination unit 2 inside. The cooling tube 41 is laminated with the semiconductor module 3 and forms the semiconductor lamination unit 2. The refrigerant introducing unit 42 and the refrigerant discharging unit 43 protrude from a cooling tube 410 arranged in one end in a lamination direction X. The case 7 includes a pair of through holes 752 and a positioning unit 71. The positioning unit 71 is arranged between the refrigerant introducing unit 42 and the refrigerant discharging unit 43 inside the case 7 and includes a startup abutting unit 711 abutting on startup units 421 and 431. |
