| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing liquid composition for a silicon wafer capable of reducing surface defects, as compared with a conventional polishing liquid composition for a silicon wafer, and to provide a method for manufacturing a semiconductor substrate using the polishing liquid composition for the silicon wafer, and a method for polishing a silicon wafer.SOLUTION: A polishing liquid composition for a silicon wafer contains: a water-soluble polymer compound A which is a cellulose derivative; a water-soluble polymer compound B in which a mass ratio of a constituent unit I represented by formula (1) and a constituent unit II represented by formula (2) is 100:0 to 40:60, the sum of the masses of the constituent unit I and the constituent unit II is 50% or more and 100% or less with respect to the total mass, and the weight average molecular weight is 4,000 or more and 16 million or less; a nitrogen-containing basic compound; silica particles; and an aqueous medium. |
