摘要 |
The present disclosure relates to a high voltage electromagnetic induction (1) device comprising: a lead-through device-receiving structure (3) having an opening (3a) for receiving a lead-through device (5), a lead-through device (5) extending through the opening (3a), the lead-through device (5) thereby having an external portion (5a) extending outside the lead-through device-receiving structure (3), and an internal portion (3b) extending within the lead-through device-receiving structure (3), wherein the internal portion (5b) is tapering in a direction (11) along the central axis (A) of the lead-through device (5) away from the opening (3a), and an electrical insulation barrier (9) which is arranged in the lead-through device-receiving structure (3), which electrical insulation barrier (9) is arranged around and distanced from the internal portion (5b), and which electrical insulation barrier (9) is tapering in said direction (11), whereby a duct (13) is formed between the internal surface (9a) of the electrical insulation barrier (9) and the external surface (5c) of the internal portion (5b) of the lead-through device (5), wherein the electrical insulation barrier (9) is tapering relative to the lead-through device (5) such that the distance between the internal surface (9a) of the electrical insulation barrier (9) and the external surface (5c) of the lead-through device increases in said direction (11). |
申请人 |
ABB Schweiz AG |
发明人 |
Wedin, Erik;Eriksson, Anders Bo;Lindgren, Jan;Berglund, Mats;Ramkvist, Mats;Bertilsson, Stina;Brunström, Tina |