A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.
申请公布号
EP1475463(B2)
申请公布日期
2017.03.01
申请号
EP20030258024
申请日期
2003.12.18
申请人
Shipley Company, L.L.C.
发明人
Barstad, Leon R.;Buckley, Thomas;Cruz, Raymond;Goodrick, Trevor;Hamm, Gary;Kapeckas, Mark J.;Price, Katie;Reddington, Erik;Sonnenberg, Wade
