发明名称 化合物半導体積層体及びその製造方法
摘要 PROBLEM TO BE SOLVED: To provide a compound semiconductor laminate which includes InAsSb having good crystallinity and excellent flatness as a compound semiconductor layer on an Si substrate.SOLUTION: A compound semiconductor laminate comprises: an Si substrate 10: a first compound semiconductor layer 11 formed on the Si substrate 10; and a second compound semiconductor layer 12 formed on the first compound semiconductor layer 11. The first compound semiconductor layer 11 has a lamination structure of any one or more than one of GaAs, GaSb, InAs, InSb and mixed crystal of GaAs, GaSb, InAs and InSb. The second compound semiconductor layer 12 is an InAsSb(0≤y≤0.3) layer and has a half-width value of a rocking curve of an X-ray diffraction peak corresponding to a plane the same with a plane orientation of a surface of the Si substrate 10 that is 1200 seconds or less, and a mean square value of surface roughness in a region of 10 μm square of the second compound semiconductor layer 12 is 12 nm or less.
申请公布号 JP6088281(B2) 申请公布日期 2017.03.01
申请号 JP20130029329 申请日期 2013.02.18
申请人 旭化成株式会社 发明人 諸原 理;外賀 寛崇
分类号 H01L21/203;H01L21/20 主分类号 H01L21/203
代理机构 代理人
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