发明名称 基板検査装置及び基板受け渡し方法
摘要 PROBLEM TO BE SOLVED: To provide a substrate inspection device and a substrate delivery method which allow for delivery of a substrate while holding the substrate firmly.SOLUTION: A wafer inspection device 1 includes a wafer mounting table 4a having a plurality of vacuum suction pads 61 for sucking a wafer W, a back arm 10 having a plurality of vacuum suction pads 71 for sucking the wafer W, and a suction auxiliary member 11 having a suction pad 81 for generating a negative pressure between the wafer W and itself, and delivering the wafer W from the mounting table 4a to the back arm 10. Upper surface of the suction pad 81 of a suction auxiliary member 11 is movable to two positions, i.e., a retreat position lower than the upper surface of the vacuum suction pad 61, and a correction position higher than the retreat position but lower than the upper surface of the vacuum suction pad 61.
申请公布号 JP6086777(B2) 申请公布日期 2017.03.01
申请号 JP20130062434 申请日期 2013.03.25
申请人 オリンパス株式会社 发明人 岡平 裕幸;望月 才博
分类号 H01L21/677;H01L21/66 主分类号 H01L21/677
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