Integrated circuit die assembly with heat spreader

摘要

A packaged semiconductor device (100) comprises a package substrate (102) comprising a first package substrate contact (116, or 902) and a second package substrate contact (114 or 914), and a semiconductor die (104) over the package substrate. The semiconductor device further includes electrical connections (112) between signal contact pads of the die and the package substrate, and a heat spreader (134) that comprises a first heat spreader portion (128) which is electrically connected to a first signal contact pad (108) and the first package substrate contact (116 or 902) and provides an electrical conduction path and a thermal conduction path. A second heat spreader portion (132) provides an electrical conduction path between a second signal contact pad and the second package substrate contact and a thermal conduction path between the die and package substrate. An insulating layer (130 or 920) is positioned between the first and second heat spreader portions.