发明名称 |
ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD |
摘要 |
An electronic component mounting device, including: a board conveyance device which conveys and positions a board on which an electronic component is mounted; a mounting device which positions and mounts the electronic component to a mounting position of the board; a loading device which picks up multiple engaged members (clips), and positions and loads the engaged members to a loading position of the board; and a placing device which picks up a cover component that covers the mounted electronic component and that is provided with an engaging portion at a predetermined position, and positions and places the cover component to a position such that the engaging portion corresponds to the engaged member. |
申请公布号 |
EP3030067(A4) |
申请公布日期 |
2017.03.01 |
申请号 |
EP20130890685 |
申请日期 |
2013.07.31 |
申请人 |
Fuji Machine Mfg. Co., Ltd. |
发明人 |
HAYASHI, Tetsuo;NAKANE, Kuniyasu;TESHIMA, Chikashi |
分类号 |
H05K13/04;H05K3/30;H05K9/00 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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