| 摘要 |
A ceramic electronic component which is easily downsized, has reduced difficulty in handling, and is hardly chipped in a chip; and a method for producing the ceramic electronic component. The method includes the steps of: forming an uncured ceramic pattern which forms a ceramic layer after firing and has a circular plane shape by applying a ceramic slurry, which contains a ceramic material, to a predetermined location one time or a plurality of times repeatedly using a non-contact-type printing device such as an ink-jet printer; and forming uncured internal electrode patterns which form internal electrodes after firing and each have a circular plane shape by applying an electrode paste, which contains an internal electrode material, to a predetermined location one time or a plurality of times repeatedly using an ink-jet printer. |
