发明名称 COOLING DEVICE
摘要 [Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases. [Means for solving the problems] It is characterized in that an evaporation unit which stores refrigerant, a condensing unit which condenses a gas-phase refrigerant produced by vaporizing the refrigerant in the evaporation unit to a liquid and dissipates heat, a vapor pipe which conveys the gas-phase refrigerant to the condensing unit, and a liquid pipe which conveys a liquid-phase refrigerant obtained by condensing the gas-phase refrigerant in the condensing unit to the evaporation unit are included, the condensing unit includes a heat dissipation flow path, an upper header which connects the vapor pipe and the heat dissipation flow path, and a lower header which connects the heat dissipation flow path and the liquid pipe, the upper header includes a flow path header portion connected to the heat dissipation flow path and an upper header extension portion located around the flow path header portion, and the upper header extension portion has a connection port connected to the vapor pipe in a face to which the heat dissipation flow path is connected.
申请公布号 EP2801781(B1) 申请公布日期 2017.03.01
申请号 EP20120864655 申请日期 2012.12.12
申请人 NEC Corporation 发明人 MATSUNAGA, Arihiro;YOSHIKAWA, Minoru;SAKAMOTO, Hitoshi;SHOUJIGUCHI, Akira;CHIBA, Masaki;INABA, Kenichi
分类号 F28D15/02;F25B23/00;F28D21/00;H01L23/427 主分类号 F28D15/02
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