Particle control in laser processing systems

摘要

The present invention generally relates to a laser processing systems for thermally processing substrates. The laser processing systems include a shield disposed between an energy source of the laser processing system and a substrate which is to be thermally processed. The shield includes an optically transparent window disposed adjacent to a cavity within the shield. The optically transparent window allows annealing energy to pass therethrough and to illuminate the substrate. The shield also includes one or more gas inlets and one or more gas outlets for introducing and removing a purge gas from the cavity within the shield. The purge gas is utilized to remove volatized or ablated components during thermal processing, and to provide a gas of predetermined composition, such as oxygen-free, to the thermally processed area.

主权项

1. An apparatus, comprising:
a substrate support enclosure configured to have a surface for supporting a workpiece inside; and a body coupled to an upper outer surface of the substrate support enclosure, the body defining a cavity and having:
a conical portion with a first end having a first diameter and a second end having a second diameter less than the first diameter, the conical portion having a tapered inner sidewall between the first end and the second end;a cylindrical portion joined to the second end of the conical portion, the cylindrical portion extending beyond the upper outer surface of the substrate support enclosure, and the cylindrical portion defining a second gas inlet port adjacent the substrate support enclosure;a first gas inlet port formed circumferentially around the first end of the conical portion, the first gas inlet port formed in the tapered inner sidewall of the conical portion; anda transparent window disposed at the first end of the conical portion configured to allow a laser to penetrate the conical portion and pass through the cylindrical portion to contact the workpiece.