发明名称 |
Anisotropic conductive film and method of producing the same |
摘要 |
An anisotropic conductive film includes a first connection layer and a second connection layer formed on one side of the first connection layer. The first connection layer is obtained by photo-radical polymerization of a photo-radical polymerizable resin layer containing an acrylate compound and a photo-radical polymerization initiator. The second connection layer includes a thermal- or photo-, cationic or anionic polymerizable resin layer containing an epoxy compound and a thermal- or photo-, cationic or anionic polymerization initiator, or a thermal- or photo-radical polymerizable resin layer containing an acrylate compound and a thermal- or photo-radical polymerization initiator. Conductive particles for anisotropic conductive connection are arranged in a single layer on a second connection layer-side surface of the first connection layer. |
申请公布号 |
US9585247(B2) |
申请公布日期 |
2017.02.28 |
申请号 |
US201314418743 |
申请日期 |
2013.08.02 |
申请人 |
DEXERIALS CORPORATION |
发明人 |
Akutsu Yasushi |
分类号 |
C09J133/04;H05K1/03;C09J163/00;H01R4/04;H01B1/22;H01L23/00;C09D4/00;C09D133/04;H05K1/11;H05K3/12 |
主分类号 |
C09J133/04 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. An anisotropic conductive film comprising a first connection layer, and a second connection layer formed on one surface of the first connecting layer, wherein
the first connection layer is obtained by photo-radical polymerization of a photo-radical polymerizable resin layer containing an acrylate compound and a photo-radical polymerization initiator, the second connection layer includes a thermal- or photo-, cationic or anionic polymerizable resin layer containing an epoxy compound and a thermal- or photo-, cationic or anionic polymerization initiator, or a thermal- or photo-radical polymerizable resin layer containing an acrylate compound and a thermal- or photo-radical polymerization initiator, and conductive particles for anisotropic conductive connection are arranged in a single layer on a second connection layer-side surface of the first connection layer. |
地址 |
Tokyo JP |