Recessed lead leadframe packages

摘要

Leadframes for semiconductor packages. Implementations may include a plurality of leads extending inwardly into an opening surrounded by the plurality of leads where the plurality of leads except for at least one are configured to mechanically couple at a surface of a semiconductor chip. The at least one of the plurality of leads that is not configured to mechanically coupled at the surface of the semiconductor chip be configured to electrically couple with the semiconductor chip.

主权项

1. A leadframe for use in a chip-on-lead package, the leadframe comprising:
the leadframe including a plurality of leads extending inwardly into an opening surrounded by the plurality of leads; one of the plurality of leads contains a thinned lead and does not extend into the opening as far as the other leads of the plurality of leads; wherein the plurality of leads are configured to directly mechanically couple at a surface of a semiconductor chip; wherein the thinned lead is configured to not directly mechanically couple at the surface of the semiconductor chip; and wherein the thinned lead comprises a thinned portion across a thickness of the thinned lead adjacent to the semiconductor chip and is configured to electrically couple with the semiconductor chip.