发明名称 |
Light receiving device and image sensor |
摘要 |
A light receiving device includes a substrate having a principal surface and a back surface, the substrate containing GaSb semiconductor co-doped with a p-type dopant and an n-type dopant; a stacked semiconductor layer disposed on the principal surface of the substrate, the stacked semiconductor layer including an optical absorption layer; and an incident surface provided on the back surface of the substrate that receives an incident light. The optical absorption layer includes a super-lattice structure including a first semiconductor layer and a second semiconductor layer that are alternately stacked. In addition, the first semiconductor layer contains gallium and antimony as constituent elements. The second semiconductor layer is composed of a material different from a material of the first semiconductor layer. |
申请公布号 |
US9583654(B2) |
申请公布日期 |
2017.02.28 |
申请号 |
US201514976303 |
申请日期 |
2015.12.21 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
Balasekaran Sundararajan;Iguchi Yasuhiro;Inada Hiroshi |
分类号 |
H01L27/146;H01L31/0304;H01L31/0352 |
主分类号 |
H01L27/146 |
代理机构 |
Smith, Gambrell & Russell, LLP. |
代理人 |
Smith, Gambrell & Russell, LLP. |
主权项 |
1. A light receiving device comprising:
a substrate having a principal surface and a back surface, the substrate containing GaSb semiconductor, the substrate being co-doped with a p-type &pant and an n-type dopant; a stacked semiconductor layer disposed on the principal surface of the substrate, the stacked semiconductor layer including an optical absorption layer; and an incident surface provided on the back surface of the substrate that receives an incident light, wherein the optical absorption layer includes a super-lattice structure including a first semiconductor layer and a second semiconductor layer that are alternately stacked, the first semiconductor layer contains gallium and antimony as constituent elements, and the second semiconductor layer is composed of a material different from a material of the first semiconductor layer. |
地址 |
Osaka JP |