Reducing directional stress in an orthotropic encapsulation member of an electronic package

摘要

Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.

主权项

1. A method of reducing directional stress in an orthotropic encapsulation member of an electronic package, the method comprising:
attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip, a base portion, and a plurality of opposing sidewalls; electrically coupling the semiconductor chip to the carrier concentrically arranged within the central opening; and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip in an opposing bivector direction towards opposing sidewalls, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction by forming:
a hole in the directional heat spreader in an area of the directional heat spreader proximal to one of a plurality of opposing stiffener sidewalls;an elastomeric column adhering the stiffening frame to the directional heat spreader within the hole in the directional heat spreader.