发明名称 High-frequency signal line
摘要 A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion.
申请公布号 US9583809(B2) 申请公布日期 2017.02.28
申请号 US201414509285 申请日期 2014.10.08
申请人 Murata Manufacturing Co., Ltd. 发明人 Kato Noboru;Ishino Satoshi;Sasaki Jun
分类号 H01P3/00;H01P3/08;H01P3/02;H01P5/02;H05K1/02 主分类号 H01P3/00
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. An electronic device comprising a high-frequency signal line, the high-frequency signal line including: a body including a first layer level and a second layer level; a signal line including a plurality of first line portions provided at the first layer level, a plurality of second line portions provided at the second layer level, and a plurality of first interlayer connections connecting the plurality of first line portions and the plurality of second line portions to each other; a first ground conductor including a first ground portion provided at the first layer level and extending along the plurality of first line portions; a second ground conductor including a second ground portion provided at the second layer level and extending along the plurality of second line portions; and a second interlayer connection connecting the first ground portion and the second ground portion to each other; wherein a distance between each of the plurality of first interlayer connections and the second interlayer connection is not less than a maximum value of a distance between each of the plurality of first line portions and the first ground portion and is not less than a maximum value of a distance between each of the plurality of second line portions and the second ground portion such that a characteristic impedance of the plurality of first line portions and the plurality of second line portions is smaller than a characteristic impedance of the plurality of first interlayer connections and the second interlayer connection; intervals between the plurality of first interlayer connections are shorter than a half wavelength of a signal transmitted on the signal line; each of the plurality of first interlayer connections and the second interlayer connection includes a via-hole conductor; and a characteristic impedance at both ends of the high-frequency signal line is an intermediate value between (i) the characteristic impedance of the plurality of first line portions and the plurality of second line portions and (ii) a characteristic impedance of the via-hole conductors of the plurality of first interlayer connections and the second interlayer connection.
地址 Kyoto JP