| 主权项 |
1. A wafer carrier comprising:
a base; an outer sidewall extending along and away from an edge of the base, the outer sidewall including an upper end; a cavity defined by the base and the outer sidewall and configured to be filled with an adhesive layer, the cavity being provided at a center of the base; and at least one inner wall extending outwardly from the base, the at least one inner wall including an upper end, wherein the wafer carrier is configured to be bonded to a wafer with the adhesive layer in the cavity such that the outer sidewall faces and is in contact with an edge of the wafer and the cavity faces a center of the wafer, wherein the outer sidewall includes at least one outer groove that is formed on the edge of the base and extends to the upper end of the outer sidewall, wherein the at least one outer groove provides an open path from the cavity to outside of the wafer carrier when the wafer carrier is bonded to the wafer, wherein the at least one inner wall comprises a plurality of inner walls, wherein the plurality of inner walls comprise at least one first inner wall comprising an end that contacts the outer sidewall, wherein the at least one inner wall divides the cavity into a plurality of inner regions, and wherein the at least one first inner wall includes at least one inner groove that extends to an upper end of the at least one first inner wall and that provides an open path between the plurality of inner regions. |
