Plane connected embedded substrate capacitor

摘要

A package substrate is provided that includes a substrate and a capacitor. The substrate comprises a cavity penetrating a core layer and metal layers of the substrate. The capacitor comprises electrode pads and is disposed in the cavity. One of the metal layers of the substrate includes a discontinuous metal plane, and the electrode pads directly contact the discontinuous metal plane.

主权项

1. A package substrate, comprising:
a substrate comprising a core layer; a first metal layer on the core layer, the first metal layer having a discontinuity formed at a cavity in the substrate; a capacitor embedded in the cavity of the substrate, the capacitor comprising first and second electrode pads, wherein portions of first metal layer are formed over the capacitor and directly contact the first and second electrode pads; and a dielectric layer separating the portions of the first metal layer in contact with the first and second electrode pads, the dielectric layer being substantially coplanar with the first metal layer.