Light emitter device packages, modules and methods

摘要

Light emitter device packages, modules and methods are disclosed having a body and a cavity that can be formed from a single substrate of material. The material can be thermally conductive and/or metallic. A light emitter device package can have at least one isolating layer creating at least a first isolated portion of the body and/or first isolated portion of the cavity. The isolating layer can be formed from the same material as the single substrate which forms the package body and cavity, and can be a layer which is thermally and electrically isolated. A light emitter or light emitter device, such as an LED chip can be mounted upon a surface of the cavity and upon at least a portion of the isolating layer.

主权项

1. A light emitter device package comprising:
a body having a cavity; at least one light emitter device disposed in the cavity and mounted to the body, wherein the body comprises an anode, a cathode, and an insulator disposed therebetween, wherein the at least one light emitter is directly attached to each of the anode, the cathode, and the insulator, and wherein the insulator inhibits electrical communications therethrough; wherein a depth of the cavity is greater than a thickness of a lower portion of the body disposed below the at least one light emitter device, and wherein the insulator comprises a layer having a substantially uniform thickness extending within the lower portion of the body; and wherein the body, including the anode, the cathode, and the insulator, is formed from a single substrate of material.