发明名称 Mounting structure of semiconductor device and method of manufacturing the same
摘要 A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device, and a length of the hard portion in a direction perpendicular to a bend line of the flexible portion is equal to a thickness of a bottom surface of the electronic component in the direction.
申请公布号 US9583416(B2) 申请公布日期 2017.02.28
申请号 US201615058671 申请日期 2016.03.02
申请人 OLYMPUS CORPORATION 发明人 Sekido Takanori;Mikami Masato
分类号 H01L23/00;H01L23/48;H01L21/56;H01L23/24;H01L23/31;H01L23/498;H01L25/065;H01L23/544 主分类号 H01L23/00
代理机构 Scully, Scott, Murphy & Presser, P.C. 代理人 Scully, Scott, Murphy & Presser, P.C.
主权项 1. A semiconductor-device mounting structure comprising: a first semiconductor device including a flexible board, an electronic component, and a sealing resin; and a plate-shaped second semiconductor device connected to the first semiconductor device, wherein the flexible board includes a bendable flexible portion and a hard portion, the flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component, the flexible board and the electronic component are sealed with the sealing resin, the first semiconductor device is mounted vertical to the second semiconductor device such that the hard portion is parallel to the second semiconductor device, a length of the hard portion in a direction perpendicular to a bend line of the flexible portion is equal to a thickness of a bottom surface of the electronic component in the direction, an air gap is formed between the bottom surface of the electronic component and the hard portion, and the sealing resin seals a gap between a side surface of the electronic component and vicinity of the flexible portion.
地址 Tokyo JP