发明名称 Lateral power MOSFET
摘要 A lateral power MOSFET structure is disclosed. In some embodiments, a semiconductor device comprises substantially concentric source, channel, and drain regions; a metal layer at least in part comprising a drain plane disposed over the source, channel, and drain regions; and a metal layer at least in part comprising a source plane disposed over the source, channel, and drain regions.
申请公布号 US9583478(B1) 申请公布日期 2017.02.28
申请号 US201113089194 申请日期 2011.04.18
申请人 Silego Technology, Inc. 发明人 Martinez Marcelo A.
分类号 H01L27/02;H01L23/522;H01L23/528;H01L29/417;H01L25/07 主分类号 H01L27/02
代理机构 Van Pelt, Yi & James LLP 代理人 Van Pelt, Yi & James LLP
主权项 1. A semiconductor device, comprising: a source region completely surrounded by substantially concentric channel and drain regions and a central body contact encircled by the source region; a first inner metal layer comprising a first drain plane disposed over the source, channel, and drain regions, wherein the first inner metal layer comprises a single plane that has one or more openings for connections; a second inner metal layer comprising a second drain plane disposed over the first inner metal layer, wherein the second inner metal layer comprises a single plane that has one or more openings for connections; and a top metal layer comprising a top source plane disposed over the inner metal layers, wherein the top source plane comprises a single plane that substantially comprises the top metal layer.
地址 Santa Clara CA US