Nano deposition and ablation for the repair and fabrication of integrated circuits

摘要

An apparatus for and methods of repairing and manufacturing integrated circuits using the apparatus. The apparatus, comprising: a vacuum chamber containing: a movable stage configured to hold a substrate; an inspection and analysis probe; a heat source; a gas injector; and a gas manifold connecting multiple gas sources to the gas injector.

主权项

1. A method, comprising:
(a) providing an apparatus including:
a vacuum chamber containing a movable stage configured to hold a substrate, an inspection and analysis probe, a heat source, a gas injector and a gas manifold, said gas manifold connecting multiple gas sources to said gas injector; (b) loading a substrate onto said movable stage; (c) scanning said substrate for defects using said inspection and analysis probe; (d) if a defect is found determining if it is (i) a short or extension between wires, (ii) an open or notch in a wire, or (iii) a void in a dielectric layer between said wires;
determining a chemical composition of said defect;selecting a gas from said multiple gas sources for repairing said defect;if said defect is a short or extension between wires either laser abating or plasma etching said defect using said selected gas;if said defect is an open or notch in a wire, depositing a conductive material to repair said defect using said selected gas; andif said defect is a void in a dielectric layer between wires, depositing a dielectric material to repair said defect using said selected gas; and (e) repeating steps (c) and (d) until no defects are found.