| 发明名称 | Imprint apparatus in which alignment control of a mold and a substrate is effected | ||
| 摘要 | An imprint apparatus performs alignment control of a mold and a substrate. A pattern formed on the mold is transferred onto a pattern forming layer on the substrate. A mold holding portion holds the mold, a substrate holding portion holds the substrate, and a control portion effects control so that the mold and the substrate are brought near to each other during the alignment control. The mold and the pattern forming layer are brought into contact with each other and then the pattern forming layer is cured. The control portion changes a driving profile for the alignment control after the alignment control is started and at least one of before and after the mold contacts the pattern forming layer. The driving profile used to move at least one of the mold holding portion and the substrate holding portion to a target position, and includes at least one of acceleration, speed, driving voltage, and driving current. | ||
| 申请公布号 | US9579843(B2) | 申请公布日期 | 2017.02.28 |
| 申请号 | US201313804973 | 申请日期 | 2013.03.14 |
| 申请人 | CANON KABUSHIKI KAISHA | 发明人 | Okushima Shingo;Suehira Nobuhito;Seki Junichi;Kasumi Kazuyuki |
| 分类号 | B29C59/02;B29C59/00;B82Y10/00;B82Y40/00;G03F7/00;G03F9/00 | 主分类号 | B29C59/02 |
| 代理机构 | Fitzpatrick, Cella, Harper & Scinto | 代理人 | Fitzpatrick, Cella, Harper & Scinto |
| 主权项 | 1. An imprint apparatus in which alignment control of a mold and a substrate is effected with respect to an in-plane direction of the substrate and a pattern formed on the mold is transferred onto a pattern forming layer provided on the substrate, the imprint apparatus comprising: a mold holding portion for holding the mold; a substrate holding portion for holding the substrate; and a control portion for effecting control so that the mold held by the mold holding portion and the substrate held by the substrate holding portion are brought near to each other while effecting the alignment control, based on a driving profile, after the alignment control is started, to bring the mold and the pattern forming layer into contact with each other and then the pattern forming layer is cured, wherein the control portion changes the driving profile for the alignment control after the alignment control is started and at least one of before and after the mold contacts the pattern forming layer, wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current. | ||
| 地址 | Tokyo JP | ||