Multi-layer substrates suitable for interconnection between circuit modules

摘要

An interposer (110) has contact pads at the top and/or bottom surfaces for connection to circuit modules (e.g. ICs 112). The interposer includes a substrate made of multiple layers (110.i). Each layer can be a substrate (110S), possibly a ceramic substrate, with circuitry. The substrates extend vertically. Multiple interposers are fabricated in a single structure (310) made of vertical layers (310.i) corresponding to the interposers' layers. The structure is diced along horizontal planes (314) to provide the interposers. An interposer's vertical conductive lines (similar to through-substrate vias) can be formed on the substrates' surfaces before dicing and before all the substrates are attached to each other. Thus, there is no need to make through-substrate holes for the vertical conductive lines. Non-vertical features can also be formed on the substrates' surfaces before the substrates are attached to each other. Other embodiments are also provided.

主权项

1. A method comprising fabricating one or more first multi-layer substrates for respective one or more members each of which is operable to function at least as an interconnection substrate for providing interconnections between circuit modules, each member comprising a plurality of contact pads for connection to the circuit modules, wherein said fabricating comprises:
forming a stack of first layers to provide a multi-layer structure, the multi-layer structure comprising circuitry comprising a transistor; separating the multi-layer structure into a plurality of multi-layer pieces at least one of which is a first multi-layer substrate which comprises a part of each first layer and comprises the transistor, the first layers' parts extending to a first side of the first multi-layer substrate, the multi-layer substrate comprising at least part of the circuitry which is accessible from the first side of the first multi-layer substrate.