Sputter source for use in a semiconductor process chamber

摘要

In some embodiments, a sputter source for a process chamber may include: a first enclosure having a top, sides and an open bottom; a target coupled to the open bottom; an electrical feed coupled to the top of the first enclosure proximate a central axis of the first enclosure to provide power to the target via the first enclosure; a magnet assembly having a shaft, a support arm coupled to the shaft, and a magnet coupled to the support arm disposed within the first enclosure; a first rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about the central axis of the first enclosure; and a second rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about a central axis of the magnet assembly.

主权项

1. A sputter source for a process chamber, comprising:
a first enclosure having a top, sides and an open bottom; a target coupled to the open bottom of the first enclosure; an electrical feed coupled to the top of the first enclosure proximate a central axis of the first enclosure to provide power to the target via the first enclosure; a magnet assembly having a shaft, a support arm coupled to the shaft, and a magnet coupled to the support arm disposed within the first enclosure; a first rotational actuator disposed off-axis with respect to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about the central axis of the magnet assembly; a second rotational actuator disposed off-axis with respect to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about a central axis of the first enclosure; and a support column disposed through the central axis of the first enclosure, the support column fixed to the top of the first enclosure and the target.