Electronic devices with moisture guiding structures

摘要

Electronic devices may have housings in which components are mounted. Some of the components may be sensitive to moisture. Other components may be insensitive to moisture and may form openings in a device housing that allow moisture to escape from within the housing. Components may be mounted on substrates such as printed circuit board substrates. Moisture repelling layers and moisture attracting layers may be patterned to form channels and other structures that guide moisture away from sensitive components towards insensitive components. Moisture repelling and attracting layers may also be used to limit the lateral spread of a conformal coating layer when coating components.

主权项

1. An electronic device, comprising:
a housing; at least one electronic component mounted on a substrate in the housing; a coating on the substrate that surrounds the at least one electronic component; a conformal coating that covers the at least one electronic component and is laterally constrained by the coating that surrounds the at least one electronic component, wherein the conformal coating is in direct contact with the coating and wherein the conformal coating and the coating are non-overlapping; and a hydrophobic coating that is formed in direct contact with the conformal coating, wherein the hydrophobic coating overlaps substantially all of the conformal coating.