Method and device of manufacturing printed circuit board having a solid component

摘要

Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.

主权项

1. A printed circuit board, comprising:
an insulating substrate that includes a resin material in which a solid component is impregnated, and has a plurality of circuit pattern grooves formed on an upper surface thereof; a plurality of buried circuit patterns that are formed to bury the circuit pattern grooves; and a metal layer disposed along the circuit pattern groove; wherein the solid component includes a glass fiber and an inorganic filler, wherein a diameter of the inorganic filler is in a range of from 0.15 μm to 0.25 μm, and wherein a void generated by separation of the inorganic filler that remains at a surface of the insulating substrate has a size of less than 1 μm.