Light-emitting-device package and production method therefor

摘要

A light-emitting-device package according to one aspect of the present invention includes: a metal substrate; a light emitting device disposed on a first surface of the metal substrate and configured to emit at least ultraviolet light; a pair of electrodes disposed to be spaced apart from each other on at least the first surface of the metal substrate, and electrically connected to the light emitting device; and an insulating layer provided between the metal substrate and the pair of electrodes. UV reflectance of the first surface of the metal body is higher than UV reflectance of the pair of electrodes.

主权项

1. A light emitting device package, comprising:
a metal substrate comprising a first surface and a second surface opposed to the first surface, wherein the metal substrate includes a cavity in a direction of the first surface; an insulation layer disposed outside the cavity and covering at least a portion of the first surface and at least a portion of the second surface; a light emitting device mounted on a bottom surface of the cavity, wherein the light emitting device is configured to emit ultraviolet light in a wavelength range from 200 nm to 380 nm; and a pair of electrodes coupled to the light emitting device, wherein the bottom surface of the cavity includes an aluminum component.