| 发明名称 |
Multiple bond via arrays of different wire heights on a same substrate |
| 摘要 |
Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires. |
| 申请公布号 |
US9583456(B2) |
申请公布日期 |
2017.02.28 |
| 申请号 |
US201514841381 |
申请日期 |
2015.08.31 |
| 申请人 |
Invensas Corporation |
发明人 |
Uzoh Cyprian Emeka;Katkar Rajesh |
| 分类号 |
H01L23/48;H01L23/00;H01L23/498;H01L21/48;H01L25/065;H01L25/16;H01L25/00 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
a substrate; first wire bond wires (“first wires”) in a first region, the first wires extending from a surface of the substrate; second wire bond wires (“second wires”) in a second region, the second wires extending from the surface of the substrate; wherein the first wires and the second wires are external to the substrate; wherein the first region is disposed at least partially within the second region; wherein the first wires are of a first height; and wherein the second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires. |
| 地址 |
San Jose CA US |
