Method of manufacturing optical device

摘要

A method uses a first mask which is comprised of an X-shaped arm, a pattern portion which is a crossed part of the X-shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion, and a second mask which is comprised of a cross-shaped arm, a pattern portion which is a crossed part of the cross shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion; and includes a first transparent member wafer metal film-forming step of superimposing the first mask on one transparent member wafer between two transparent member wafers and forming a metal film between the pattern portions and the frame members, a second transparent member wafer metal film-forming step of superimposing the second mask on the other transparent member wafer.

主权项

1. A method for producing optical devices each configured by bonding a first transparent member and a second transparent member, using:
a first mask which is comprised of first arms, pattern portions each connected with one of the first arms and formed in a polygon shape or circle shape, and a frame member which is connected to the pattern portions, and a second mask which is comprised of second arms provided in a direction different from that of the first arms of the first mask, pattern portions each connected with one of the second arms and formed in a polygon shape or circle shape, and a frame member which is connected to the pattern portions; and comprising: a first transparent member wafer metal film-forming step of superimposing the first mask on a first transparent member wafer having portions which become pluralities of the first transparent members and forming a first metal film between the pattern portions and the frame member, a second transparent member wafer metal film-forming step of superimposing the second mask on a second transparent member wafer having portions which become pluralities of the second transparent members and forming a second metal film between the pattern portions and the frame member, a bonding step of making the first metal film side of the first transparent member wafer and the second metal film side of the second transparent member wafer face each other and bonding these wafers at a predetermined temperature and under a predetermined pressure, and a dicing step of dicing the bonded first and second transparent member wafers to form individual optical devices, wherein: each of the first arms forms an X-shape having one of the pattern portions as the crossed part, and each of the second arms forms a cross shape having one of the pattern portions as the crossed part.