Method for slicing wafers from a workpiece using a sawing wire

摘要

A method for slicing wafers from a workpiece using a sawing wire, wherein at least two wire guide rolls clamp a wire web, each wire guide roll having a multiplicity of grooves in its lateral surface, wherein at least one groove in which no wire is inserted during the wire sawing is present alongside a wire-guiding groove and, after wear on the wire-guiding grooves or after a defined number of sawing processes, the sawing wire is wound over into the previously unoccupied grooves that are not yet worn or used, respectively.

主权项

1. A method for slicing a wafer from a workpiece using a sawing wire, the method comprising:
forming a wire web with the sawing wire, the wire web comprising a multiplicity of wire sections arranged parallel, and the wire web being clamped at least by two wire guide rolls, a wire inlet side roll and a wire outlet side roll; and guiding the sawing wire by the at least two wire guide rolls through wire-guiding grooves, the wire-guiding grooves having a distance A between each another, in two lateral surfaces, an each groove having a width C, wherein at least one further groove, in which no wire is inserted during the wire sawing, is present alongside a wire-guiding groove, and wherein the width C of the wire-guiding grooves and the further groove decreases from the wire inlet side roll to the wire outlet side roll.