Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

摘要

A stackable microelectronic package includes a first microelectronic die attached to and electrically connecting with a first substrate. A second microelectronic die is attached to the first die on one side, and to a second substrate on the other side. Electrical connections are made between the first die and the first substrate, between the second die and the second substrate, and between the first and second substrates, e.g., via wire bonding. The electrical connecting elements are advantageously encased in a molding compound. Exposed contacts on the first and/or second substrates, not covered by the molding compound, provide for electrical connections between the package, and another package stacked onto the package. The package may avoid coplanarity factors, can be manufactured using existing equipment, allows for intermediate testing, and can also offer a thinner package height.

主权项

1. A method for manufacturing a microelectronic package, comprising:
attaching a first die to a first substrate having a first external contact facing a first direction, a first wire bond contact facing a second direction opposite the first direction, and wherein the first substrate has a through opening; extending wires from a plurality of contacts on the first die through the through opening to contacts facing the first direction; attaching a second die to the first die; attaching a second substrate to the second die, the second substrate having a second external contact and a second wire bond contact facing the second direction; disposing a first wire bond between the first wire bond contact at the first substrate and the second wire bond contact at the second substrate; and encapsulating the first and second wire bond contacts and the first wire bond with a molding compound without covering the first external contact or the second external contact.