Fan out system in package and method for forming the same

摘要

Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked die between the first and second RDLs, and conductive pillars extending between the RDLs. A molding compound may encapsulate the stacked die and conductive pillars between the first and second RDLs.

主权项

1. A package comprising:
a first redistribution layer (RDL) including a first interior side and first exterior side; a first top die bonded to the first interior side of the first RDL; a second RDL under the first RDL, the second RDL including a second interior side and second exterior side; a bottom die bonded to the second interior side of the second RDL, wherein the first top die is stacked on the bottom die and the first top die is not directly electrically coupled with the bottom die; a second top die bonded to the first interior side of the first RDL, wherein the first and second top die are attached to the bottom die, and the first and second top die together occupy a larger area than the bottom die; a plurality of conductive pillars extending from the first interior side of the first RDL to the second interior side of the second RDL; and a molding compound located between the first interior side of the first RDL and the second interior side of the second RDL, wherein the molding compound encapsulates the plurality of conductive pillars, the first top die, the second top die, and the bottom die between the first interior side and the second interior side.