发明名称 |
Embedding thin chips in polymer |
摘要 |
Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region. |
申请公布号 |
US9583428(B2) |
申请公布日期 |
2017.02.28 |
申请号 |
US201514859112 |
申请日期 |
2015.09.18 |
申请人 |
MC10, Inc. |
发明人 |
Rafferty Conor;Dalal Mitul |
分类号 |
H01L23/495;H01L23/498;H01L23/538;H01L23/31;H01L23/16;H01L21/56;H01L23/00;H01L21/683;H05K1/02;H05K1/18 |
主分类号 |
H01L23/495 |
代理机构 |
Nixon Peabody LLP |
代理人 |
Nixon Peabody LLP |
主权项 |
1. An apparatus comprising:
A) a substrate comprising a standoff well region, wherein:
the substrate comprises a layer of a first conductive material disposed on a layer of a flexible polymer that is further stretchable; anda patterned portion of the first conductive material comprises a standoff bordering a portion of exposed flexible polymer, thereby forming the standoff well region; and B) a thin chip disposed within the standoff well region on a portion of the exposed flexible polymer proximate to the standoff, wherein a height of the standoff is comparable to a height of the thin chip. |
地址 |
Lexington MA US |