发明名称 |
Supercritical drying method for semiconductor substrate and supercritical drying apparatus |
摘要 |
A supercritical drying method for a semiconductor substrate is disclosed. The method may include introducing the semiconductor substrate into a chamber in a state, a surface of the semiconductor substrate being wet with alcohol, substituting the alcohol on the semiconductor substrate with a supercritical fluid of carbon dioxide by impregnating the semiconductor substrate to the supercritical fluid in the chamber, and discharging the supercritical fluid and the alcohol from the chamber and reducing a pressure inside the chamber. The method may also include performing a baking treatment by supplying an oxygen gas or an ozone gas to the chamber after the reduction of the pressure inside the chamber. |
申请公布号 |
US9583330(B2) |
申请公布日期 |
2017.02.28 |
申请号 |
US201414283874 |
申请日期 |
2014.05.21 |
申请人 |
Tokyo Electron Limited |
发明人 |
Ji Linan;Hayashi Hidekazu;Tomita Hiroshi;Okuchi Hisashi;Sato Yohei;Toshima Takayuki;Iwashita Mitsuaki;Mitsuoka Kazuyuki;You Gen;Ohno Hiroki;Orii Takehiko |
分类号 |
F26B3/00;H01L21/02;F26B21/10;F26B21/14;F26B23/02;H01L21/67 |
主分类号 |
F26B3/00 |
代理机构 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
代理人 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
主权项 |
1. A supercritical drying apparatus comprising:
a chamber housing a semiconductor substrate and being hermetically sealable; a heater heating an inside of the chamber; a first pipe supplying carbon dioxide to the chamber; a second pipe discharging the carbon dioxide from the chamber; a third pipe supplying an oxygen gas or an ozone gas to the chamber; a controller that:
controls the heater to reach a first predefined temperature inside the chamber;supplies oxygen to the chamber responsive to the chamber reaching a predetermined pressure; andcontrols the heater so that a temperature inside the chamber is increased to a temperature equal to or more than a thermodecomposition temperature or a boiling point of an organic component contained in the carbon dioxide remaining inside the chamber after the semiconductor substrate is impregnated to a supercritical fluid of the carbon dioxide and then the supercritical fluid is discharged. |
地址 |
Tokyo JP |