发明名称 RESIN SHEET FOR SEALING
摘要 In order to provide a resin sheet for sealing that has increased thermal conductivity, the present invention provides a resin sheet for sealing that includes a first filler and a second filler, said first filler being a secondary aggregate formed by aggregating thermally anisotropic boron nitride crystals, in which thermal conductivity differs depending on the direction, so as to be isotropic, wherein the thermal conductivity after thermosetting is 3 W/m·K or more.
申请公布号 SG11201610344Q(A) 申请公布日期 2017.02.27
申请号 SG11201610344Q 申请日期 2015.06.04
申请人 NITTO DENKO CORPORATION 发明人 FURUKAWA, YOSHIHIRO;TOYODA, EIJI;HABU, TAKASHI
分类号 C08J5/18;C08K3/22;C08K3/36;C08K3/38 主分类号 C08J5/18
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