| 摘要 |
The purpose of the present invention is to provide a solder alloy, solder ball, chip solder, solder paste and solder joint in which discoloration is suppressed and growth of oxide films is suppressed in high temperature and high humidity environments. The solder alloy contains 0.005-0.1 mass% of Mn and 0.001-0.1 mass% of Ge, with the remainder comprising Sn as a primary component. By adding 0.005-0.1 mass% of Mn and 0.001-0.1 mass% of Ge to a solder alloy comprising Sn as a primary component, Ge oxides are distributed largely on the outermost surface side of an oxide film containing oxides of Sn, oxides of Mn and oxides of Ge, and a discoloration prevention effect can be obtained even in high humidity environments. In addition, because Mn reacts with O2, reactions between Sn and O2 are suppressed and the generation of oxides of Sn is suppressed, and as a result thereof, an increase in the thickness of an oxide film is suppressed and fusion properties are improved. |
