| 摘要 |
The method involves depositing a sacrificial layer structure (1) as a paste on a substrate (3). The paste of solid, glass and/or ceramic particles and a pasting agent with an organic binder, and an organic solvent, is applied on the substrate and then dried at 100-200 [deg] C for 5-30 min. A functional layer (5) is deposited on the substrate. The substrate consisting of functional layer is partially covered by the sacrificial layer structure. The porous regions partially formed on the sacrificial layer structure, are removed from the substrate by injecting water and/or organic solvent. An independent claim is included for a component or circuit board. |
