发明名称 POWER ELECTRONIC SUBASSEMBLY WITH CAPACITOR
摘要 A power electronic subassembly having a housing and a capacitor arranged therein. The housing has an internally arranged cooling area, which is cooled by a cooling device integrated in the housing or an external cooling device. The capacitor has a contact device of a first polarity and a contact device of a second polarity and a capacitor busbar system. This capacitor busbar system comprises first and second sheet-like shaped metal bodies. The first metal body with the first contact device of the first polarity and the second metal body with the second contact device of the second polarity are electrically conductively connected. A first portion of the first metal body has a first subportion, which is arranged parallel to and at a distance from the cooling area, and a second subportion, which is in thermal contact with the cooling area, wherein the two subportions are connected by an intermediate portion.
申请公布号 US2017055366(A1) 申请公布日期 2017.02.23
申请号 US201615243168 申请日期 2016.08.22
申请人 Semikron Elektronik GmbH & Co., KG 发明人 BACKHAUS Klaus;BITTNER Roland;LEDERER Marco;POPP Rainer
分类号 H05K7/20;H01G2/08;H01L23/367;H01L23/02;H01L23/467;H01L23/473;H01G2/02;H01G2/10 主分类号 H05K7/20
代理机构 代理人
主权项 1. A power electronic subassembly comprising: a housing having an internally arranged cooling area, said cooling area being configured so that it can be cooled by means of a cooling device; and a capacitor device arranged in said housing, said capacitor device having a capacitor with a first contact device of a first polarity, a second contact device of a second polarity and a capacitor busbar system, said capacitor busbar system including a first sheet-like shaped metal body and a second sheet-like shaped metal body; wherein said first and second sheet-like shaped metal bodies are connected in an electrically conducting manner, and wherein a first portion of said first shaped metal body has a first subportion which is arranged parallel to and at a distance from said cooling area, anda second subportion, which is in thermal contact with said cooling area, and which is connected to said first subportion by an intermediate portion.
地址 Numberg DE