发明名称 |
Aligned Particle Coating |
摘要 |
A method of manufacturing a coating for an e-paper assembly includes forming a coating layer from conductive particles dispersed within an insulative matrix. A field is applied to cause the conductive particles to align in generally parallel, spaced apart elongate patterns that are generally perpendicular to a plane through which the coating layer extends. At ambient temperatures and without applied pressure, the coating layer is cured via radiation energy while maintaining the applied field. |
申请公布号 |
US2017052420(A1) |
申请公布日期 |
2017.02.23 |
申请号 |
US201415306058 |
申请日期 |
2014.04.25 |
申请人 |
Hewlett-Packard Development Company, L.P. |
发明人 |
CHUN Doris;Leoni Napoleon J |
分类号 |
G02F1/167;B05D3/06;B05D3/00 |
主分类号 |
G02F1/167 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of manufacturing a coating for an e-paper structure, the method comprising:
forming a first layer from a coating in which conductive particles are dispersed within a substantially insulative matrix; applying a field to cause the conductive particles to align in generally parallel, spaced apart elongate patterns that are generally perpendicular to a plane through which the first layer extends; and curing, at ambient temperatures and without applied pressure, the first layer via radiation energy while maintaining the applied field to produce the coating with at least a non-adhesive outer surface. |
地址 |
Fort Collins CO US |